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Product Features

  • Exceptional Thermal & Mechanical Resistance – High impact strength and durability.

  • Engineering-Grade Material – Ideal for demanding applications.

  • High-Temperature Reusable Spool – Ensures sustainability.

  • Precise Diameter – 1.75mm ± 0.03mm for consistent performance.

 

Usage Guidelines

  • Dry Before Use – Recommended drying: 80°C for 8h.

  • AMS CompatibleNot compatible with AMS Lite.

  • Requires Enclosed Printer – Ensures optimal print quality.

 

Accessory Compatibility

  • Recommended: Smooth PEI Plate, Textured PEI Plate, All Size/Material Hotends.

  • Not Recommended: Cool Plate SuperTack, Bambu Liquid Glue.

 

Intelligent Printing with RFID

  • Embedded printing parameters for seamless AMS integration.

 

Printing Settings

  • Nozzle Temp: 250-270°C

  • Bed Temp (with glue): 90-110°C

  • Max Speed: 300 mm/s

  • Humidity Storage: <20% RH with desiccant

 

Physical & Mechanical Properties

  • Density: 1.20 g/cm³

  • Vicat Softening Temp: 119°C

  • Tensile Strength: 55 ± 4 MPa

  • Impact Strength: 34.8 ± 2.1 kJ/m²

 

What's in the Box

  • Filament x1 & Desiccant x1

Bambu Lab PC Filament with Spool

$39.99Price
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