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Bambu Lab H2D Pro 3D Printer
Bambu Lab H2D Pro 3D Printer
Bambu Lab H2D Pro 3D Printer
Bambu Lab H2D Pro 3D Printer
Bambu Lab H2D Pro 3D Printer

Bambu Lab H2D Pro 3D Printer

$3,799.00
Product Features

 

  • 350℃ (662°F) High-Temperature Dual Nozzle Printing
  • Auxilary Extruder Cooling Fan
  • Tungsten Carbide Super Durable Nozzle
  • 65℃ (149°F) Active Chamber Heating
  • 50um Motion Accuracy
  • Ethernet Connection
  • Physical Network Killswitch
  • WPA2-Enterprise Wi-Fi Authentication
  • Adaptive Air Circulation & HEPA Filterin

Key New Features of the H2D Pro:
  1.    Network Support: Includes wired networking and enterprise network authentication. 
  2.    Tungsten Carbide Hotend: Offers increased durability and precision.  
  3.    Enhanced Toolhead Cooling: Upgraded fan system for improved thermal management.  
  4.    Additional Components: Now includes the AMS HT and visual coding board.  
  5.    Expanded Storage on AP Board: Provides greater capacity while maintaining compatibility with existing H2D functionality, with future support for customizable solutions.  
Quantity
Bambu Lab H2D Pro 3D Printer
Bambu Lab H2D Pro 3D Printer
Bambu Lab H2D Pro 3D Printer
Bambu Lab H2D Pro 3D Printer
Bambu Lab H2D Pro 3D Printer

Bambu Lab H2D Pro 3D Printer

$3,799.00
Product Features

 

  • 350℃ (662°F) High-Temperature Dual Nozzle Printing
  • Auxilary Extruder Cooling Fan
  • Tungsten Carbide Super Durable Nozzle
  • 65℃ (149°F) Active Chamber Heating
  • 50um Motion Accuracy
  • Ethernet Connection
  • Physical Network Killswitch
  • WPA2-Enterprise Wi-Fi Authentication
  • Adaptive Air Circulation & HEPA Filterin

Key New Features of the H2D Pro:
  1.    Network Support: Includes wired networking and enterprise network authentication. 
  2.    Tungsten Carbide Hotend: Offers increased durability and precision.  
  3.    Enhanced Toolhead Cooling: Upgraded fan system for improved thermal management.  
  4.    Additional Components: Now includes the AMS HT and visual coding board.  
  5.    Expanded Storage on AP Board: Provides greater capacity while maintaining compatibility with existing H2D functionality, with future support for customizable solutions.  
Quantity

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